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microcontrollers c166 family 16-bit single-chip microcontroller c167cr-xc, bare die, step ga data sheet 1999-11 (bare die delivery) c167cr-xc step ga www.infineon.com
edition 1999-11 published by infineon technologies ag, st.-martin-strasse 53 d-81541 mnchen ? infineon technologies ag 1999. all rights reserved. attention please! the information herein is given to describe certain components and shall not be considered as warranted characteristics. terms of delivery and rights to technical change reserved. we hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, des criptions and charts stated herein. infineon technologies is an approved cecc manufacturer. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologi es office in germany or our infineon technologies representatives worldwide (see address list). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please cont act your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infin eon tech- nologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system , or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. controller area network (can): license of robert bosch gmbh c167cr-xc (bare die delivery) revision history: 1999-11, step ga previous versions: 1999-11 (step fa) 10.97 (step ba) 05.97 (step ba) page subjects (changes compared to step ba) 2 derivative table updated 4 - 12 pad configuration updated (figure and table) 1) 1) pad coordinates have changed compared to step fa. 14, 15 representation of parameters updated 16 chip outline adapted 17 wafer characteristics adapted we listen to your comments any information within this document that you feel is wrong, unclear or missing at all? your feedback will help us to continuously improve the quality of this document. please send your proposal (including a reference to this document) to: mcdocu.comments@infineon.com
? high performance 16-bit cpu with 4-stage pipeline ? 80 ns instruction cycle time at 25/ mhz cpu clock ? 400 ns multiplication (16 16 bit), 800 ns division (32 / 16 bit) ? enhanced boolean bit manipulation facilities ? additional instructions to support hll and operating systems ? register-based design with multiple variable register banks ? single-cycle context switching support ? 16 mbytes total linear address space for code and data ? 1024 bytes on-chip special function register area 16-priority-level interrupt system with 56 sources, sample-rate down to 40 ns 8-channel interrupt-driven single-cycle data transfer facilities via peripheral event controller (pec) clk. generation via on-chip pll (1:1.5/2/2.5/3/4/5), via prescaler or via direct clk. inp. on-chip memory modules ? 2 kbytes on-chip internal ram (iram) ? 2 kbytes on-chip extension ram (xram) ? 32 kbytes on-chip mask rom optional on-chip peripheral modules ? 16-channel 10-bit a/d converter with programmable conversion time down to 7.8 s ? two 16-channel capture/compare units ? 4-channel pwm unit ? two multi-functional general purpose timer units with 5 timers ? two serial channels (synchronous/asynchronous and high-speed-synchronous) ? on-chip can interface (rev. 2.0b active) with 15 message objects (full can / basic can) up to 16 mbytes external address space for code and data ? programmable external bus characteristics for different address ranges ? multiplexed or demultiplexed external address/data buses with 8-bit or 16-bit data bus width ? five programmable chip-select signals ? hold- and hold-acknowledge bus arbitration support idle and power down modes programmable watchdog timer and oscillator watchdog up to 111 general purpose i/o lines, partly with selectable input thresholds and hysteresis c166 family of c167cr-xc high-performance cmos 16-bit microcontrollers preliminary c167cr-xc 16-bit microcontroller data sheet 1 1999-11
c167cr bare die step ga data sheet 2 1999-11 supported by a large range of development tools like c-compilers, macro-assembler packages, emulators, evaluation boards, hll-debuggers, simulators, logic analyzer disassemblers, programming boards on-chip bootstrap loader ordering information note: the ordering codes for mask-rom versions are defined for each product after verification of the respective rom code. for simplicity all versions are referred to by the term c167cr-xc throughout this document. table 1 bare die ordering information type ordering code wafers function sak-c167cr-lc q67120- c2227 whole 16-bit microcontroller with 2*2 kbyte ram, on-chip can temperature range -40 to +125 c sak-c167cr-4rc q67120- d.... whole 16-bit microcontroller with 32 kbyte rom 2*2 kbyte ram, on-chip can temperature range -40 to +125 c sak-c167cr-lc q67120- c2226 sawn 16-bit microcontroller with 2*2 kbyte ram, on-chip can temperature range -40 to +125 c
c167cr bare die step ga data sheet 3 1999-11 introduction the c167cr-xc derivatives are high performance derivatives of the infineon c166 family of full featured single-chip cmos microcontrollers. they combine high cpu performance (up to 12.5 million instructions per second) with high peripheral functionality and enhanced io-capabilities. they also provide clock generation via pll and various on-chip memory modules like program rom, internal ram, and extension ram. figure 1 logic symbol c167cr-xc
c167cr bare die step ga data sheet 4 1999-11 pad configuration (top view) figure 2 c167cr-xc pad 1 pad 150 y x 0.0 0.0 pad 38 pad 39 pad 76 pad 115 pad 114 pad 77
c167cr bare die step ga data sheet 5 1999-11 table 2 pad definitions and functions symbol pad num in / out position [m] function xy v aref 1 - 380 0 reference voltage for the a/d converter. v agnd 2 - 543 0 reference ground for the a/d converter. p5.10 3 i 705 0 port 5 input, analog input an10, external up/down t6eud. p5.11 4 i 868 0 port 5 input, analog input an11, external up/down t5eud. p5.12 5 i 1030 0 port 5 input, analog input an12, timer input t6in. p5.13 6 i 1193 0 port 5 input, analog input an13, timer input t5in. p5.14 7 i 1356 0 port 5 input, analog input an14, external up/down t4eud. p5.15 8 i 1518 0 port 5 input, analog input an15, external up/down t2eud. v ss 9 - 1715 0 digital ground. v ss 10 - 1840 0 digital ground. v dd 11 - 1965 0 digital supply voltage. v dd 12 - 2090 0 digital supply voltage. p2.0 13 i/o 2403 0 port 2 input/output (open drain, sp. threshold), capture-input/compare-output cc0io. p2.1 14 i/o 2528 0 port 2 input/output (open drain, sp. threshold), capture-input/compare-output cc1io. p2.2 15 i/o 2653 0 port 2 input/output (open drain, sp. threshold), capture-input/compare-output cc2io. p2.3 16 i/o 2779 0 port 2 input/output (open drain, sp. threshold), capture-input/compare-output cc3io. p2.4 17 i/o 2904 0 port 2 input/output (open drain, sp. threshold), capture-input/compare-output cc4io. p2.5 18 i/o 3038 0 port 2 input/output (open drain, sp. threshold), capture-input/compare-output cc5io. p2.6 19 i/o 3163 0 port 2 input/output (open drain, sp. threshold), capture-input/compare-output cc6io.
c167cr bare die step ga data sheet 6 1999-11 p2.7 20 i/o 3289 0 port 2 input/output (open drain, sp. threshold), capture-input/compare-output cc7io. v ss 21 - 3414 0 digital ground. v dd 22 - 3539 0 digital supply voltage. p2.8 23 i/o 3664 0 port 2 input/output (open drain, sp. threshold), capt. input/comp. output cc8io, fast interrupt ex0in. p2.9 24 i/o 3789 0 port 2 input/output (open drain, sp. threshold), capt. input/comp. output cc9io, fast interrupt ex1in. p2.10 25 i/o 3914 0 port 2 input/output (open drain, sp. threshold), capt. input/comp. output cc10io, fast interrupt ex2in. p2.11 26 i/o 4039 0 port 2 input/output (open drain, sp. threshold), capt. input/comp. output cc11io, fast interrupt ex3in. p2.12 27 i/o 4164 0 port 2 input/output (open drain, sp. threshold), capt. input/comp. output cc12io, fast interrupt ex4in. p2.13 28 i/o 4289 0 port 2 input/output (open drain, sp. threshold), capt. input/comp. output cc13io, fast interrupt ex5in. p2.14 29 i/o 4414 0 port 2 input/output (open drain, sp. threshold), capt. input/comp. output cc14io, fast interrupt ex6in. p2.15 30 i/o 4540 0 port 2 input/output (open drain, sp. threshold), capt. input/comp. output cc15io, fast interrupt ex7in, timer t7 input t7in. p3.0 31 i/o 4665 0 port 3 input/output (open drain, sp. threshold), timer t0 input t0in. p3.1 32 i/o 4790 0 port 3 input/output (open drain, sp. threshold), timer t6 toggle latch output t6out. p3.2 33 i/o 4915 0 port 3 input/output (open drain, sp. threshold), caprel capture input capin. table 2 pad definitions and functions (continued) symbol pad num in / out position [m] function xy
c167cr bare die step ga data sheet 7 1999-11 p3.3 34 i/o 5045 0 port 3 input/output (open drain, sp. threshold), timer t3 toggle latch output t3out. p3.4 35 i/o 5179 0 port 3 input/output (open drain, sp. threshold), timer t3 ext.up/down t3eud. p3.5 36 i/o 5318 0 port 3 input/output (open drain, sp. threshold), timer t4 input t4in. v ss 37 - 5462 0 digital ground. v dd 38 - 5587 0 digital supply voltage. p3.6 39 i/o 5967 380 port 3 input/output (open drain, sp. threshold), timer t3 input t3in. p3.7 40 i/o 5967 505 port 3 input/output (open drain, sp. threshold), timer t2 input t2in. p3.8 41 i/o 5967 649 port 3 input/output (open drain, sp. threshold), ssc master-rec./slave-transmit i/o mrst. p3.9 42 i/o 5967 788 port 3 input/output (open drain, sp. threshold), ssc master-transmit/slave-rec. o/i mtsr. p3.10 43 i/o 5967 922 port 3 input/output (open drain, sp. threshold), asc0 clock/data output (asyn./syn.) t d0. p3.11 44 i/o 5967 1052 port 3 input/output (open drain, sp. threshold), asc0 data input (asyn.) or i/o (syn.) r d0. p3.12 45 i/o 5967 1177 port 3 input/output (open drain, sp. threshold). 46 o 5967 1302 high byte enable bhe , high byte write strobe wrh . p3.13 47 i/o 5967 1427 port 3 input/output (open drain, sp. threshold), ssc master(slave) clock output(input) sclk. p3.15 48 i/o 5967 1552 port 3 input/output (open drain, sp. threshold). 49 o 5967 1678 system clock output (=cpu clock) clkout. v dd 50 - 5967 1897 digital supply voltage. v ss 51 - 5967 2022 digital ground. owe 52 i 5967 2248 osc. watchdog enable, disables owd when low, should be high or nc during normal op. p4.0 53 i/o 5967 2373 port 4 input/output, segment address line a16. table 2 pad definitions and functions (continued) symbol pad num in / out position [m] function xy
c167cr bare die step ga data sheet 8 1999-11 p4.1 54 i/o 5967 2498 port 4 input/output, segment address line a17. p4.2 55 i/o 5967 2623 port 4 input/output, segment address line a18. p4.3 56 i/o 5967 2748 port 4 input/output, segment address line a19. p4.4 57 i/o 5967 2873 port 4 input/output, segment address line a20. p4.5 58 i/o 5967 3113 port 4 input/output, segment address line a21, can receive data input can_rxd. p4.6 59 i/o 5967 3238 port 4 input/output, segment address line a22 can transmit data output can_txd. p4.7 60 i/o 5967 3363 port 4 input/output, segment address line a23. v dd 61 - 5967 3488 digital supply voltage. v ss 62 - 5967 3613 digital ground. rd 63 o 5967 3738 external memory read strobe rd . wr (l ) 64 o 5967 3863 external memory write(low) strobe wr (wrl ). ready 65 i 5967 3988 ready input. ale 66 o 5967 4114 address latch enable output. ea 67 i 5967 4239 external access enable pin. p0l.0 68 i/o 5967 4364 port0 input/output, address/data line ad0. p0l.1 69 i/o 5967 4489 port0 input/output, address/data line ad1. p0l.2 70 i/o 5967 4614 port0 input/output, address/data line ad2. p0l.3 71 i/o 5967 4739 port0 input/output, address/data line ad3. p0l.4 72 i/o 5967 4869 port0 input/output, address/data line ad4. p0l.5 73 i/o 5967 5003 port0 input/output, address/data line ad5. p0l.6 74 i/o 5967 5142 port0 input/output, address/data line ad6. p0l.7 75 i/o 5967 5286 port0 input/output, address/data line ad7. p0h.0 76 i/o 5967 5411 port0 input/output, address/data line ad8. v dd 77 - 5587 5791 digital supply voltage. rom 128k 78 i 5462 5791 rom size-select input, must be connected to v ss . (connected to v dd in the c167cr-16rm) v ss 79 - 5318 5791 digital ground. table 2 pad definitions and functions (continued) symbol pad num in / out position [m] function xy
c167cr bare die step ga data sheet 9 1999-11 p0h.1 80 i/o 5179 5791 port0 input/output, address/data line ad9. p0h.2 81 i/o 5045 5791 port0 input/output, address/data line ad10. p0h.3 82 i/o 4915 5791 port0 input/output, address/data line ad11. p0h.4 83 i/o 4790 5791 port0 input/output, address/data line ad12. p0h.5 84 i/o 4665 5791 port0 input/output, address/data line ad13. p0h.6 85 i/o 4540 5791 port0 input/output, address/data line ad14. p0h.7 86 i/o 4414 5791 port0 input/output, address/data line ad15. p1l.0 87 i/o 4289 5791 port1 input/output, address line a0. p1l.1 88 i/o 4164 5791 port1 input/output, address line a1. p1l.2 89 i/o 4039 5791 port1 input/output, address line a2. p1l.3 90 i/o 3914 5791 port1 input/output, address line a3. p1l.4 91 i/o 3789 5791 port1 input/output, address line a4. p1l.5 92 i/o 3664 5791 port1 input/output, address line a5. p1l.6 93 i/o 3539 5791 port1 input/output, address line a6. p1l.7 94 i/o 3414 5791 port1 input/output, address line a7. v dd 95 - 3289 5791 digital supply voltage. v ss 96 - 3163 5791 digital ground. p1h.0 97 i/o 2779 5791 port1 input/output, address line a8. p1h.1 98 i/o 2654 5791 port1 input/output, address line a9. p1h.2 99 i/o 2529 5791 port1 input/output, address line a10. p1h.3 100 i/o 2404 5791 port1 input/output, address line a11. p1h.4 101 i/o 2279 5791 port1 input/output, addr. line a12, capt. input cc24. p1h.5 102 i/o 2154 5791 port1 input/output, addr. line a13, capt. input cc25. p1h.6 103 i/o 2029 5791 port1 input/output, addr. line a14, capt. input cc26. p1h.7 104 i/o 1904 5791 port1 input/output, addr. line a15, capt. input cc27. v dd 105 - 1685 5791 digital supply voltage. table 2 pad definitions and functions (continued) symbol pad num in / out position [m] function xy
c167cr bare die step ga data sheet 10 1999-11 xtal2 106 o 1560 5791 output of the oscillator amplifier circuit. xtal1 107 i 1396 5791 input to oscillator amplifier and internal clock generator. v ss 108 - 1271 5791 digital ground. rstin 109 i/o 1052 5791 reset input with schmitt-trigger characteristics, output in bidirectional reset mode. rst out 110 o 922 5791 internal reset indication output. nmi 111 i 788 5791 non-maskable interrupt input. v ss 112 - 649 5791 digital ground. xp1_en 113 i 505 5791 can module enable input, must be connected to v ss . (connected to v dd in the c167sr-xy) v dd 114 - 380 5791 digital supply voltage. p6.0 115 i/o 0 5411 port 6 input/output, chip select 0 output cs0 . p6.1 116 i/o 0 5286 port 6 input/output, chip select 1 output cs1 . p6.2 117 i/o 0 5142 port 6 input/output, chip select 2 output cs2 . p6.3 118 i/o 0 5003 port 6 input/output, chip select 3 output cs3 . p6.4 119 i/o 0 4869 port 6 input/output, chip select 4 output cs4 . p6.5 120 i/o 0 4739 port 6 input/output, external hold request input hold . p6.6 121 i/o 0 4614 port 6 input/output, external hold acknowledge output hlda . p6.7 122 i/o 0 4489 port 6 input/output, bus request output breq . p8.0 123 i/o 0 4364 port 8 input/output, capt.-input/comp.-output cc16io. p8.1 124 i/o 0 4239 port 8 input/output, capt.-input/comp.-output cc17io. p8.2 125 i/o 0 4114 port 8 input/output, capt.-input/comp.-output cc18io. p8.3 126 i/o 0 3988 port 8 input/output, capt.-input/comp.-output cc19io. table 2 pad definitions and functions (continued) symbol pad num in / out position [m] function xy
c167cr bare die step ga data sheet 11 1999-11 p8.4 127 i/o 0 3863 port 8 input/output, capt.-input/comp.-output cc20io. p8.5 128 i/o 0 3738 port 8 input/output, capt.-input/comp.-output cc21io. p8.6 129 i/o 0 3613 port 8 input/output, capt.-input/comp.-output cc22io. p8.7 130 i/o 0 3488 port 8 input/output, capt.-input/comp.-output cc23io. v dd 131 - 0 3363 digital supply voltage. v ss 132 - 0 3238 digital ground. p7.0 133 i/o 0 3113 port 7 input/output, (open drain, sp. threshold), pwm channel output pout0. p7.1 134 i/o 0 2988 port 7 input/output, (open drain, sp. threshold), pwm channel output pout1. p7.2 135 i/o 0 2863 port 7 input/output, (open drain, sp. threshold), pwm channel output pout2. p7.3 136 i/o 0 2737 port 7 input/output, (open drain, sp. threshold), pwm channel output pout3. p7.4 137 i/o 0 2612 port 7 input/output, (open drain, sp. threshold), capt.-input/comp.-output cc28io. p7.5 138 i/o 0 2487 port 7 input/output, (open drain, sp. threshold), capt.-input/comp.-output cc29io. p7.6 139 i/o 0 2362 port 7 input/output, (open drain, sp. threshold), capt.-input/comp.-output cc30io. p7.7 140 i/o 0 2237 port 7 input/output, (open drain, sp. threshold), capt.-input/comp.-output cc31io. p5.0 141 i 0 1843 port 5 input, analog input an0. p5.1 142 i 0 1681 port 5 input, analog input an1. p5.2 143 i 0 1518 port 5 input, analog input an2. p5.3 144 i 0 1356 port 5 input, analog input an3. p5.4 145 i 0 1193 port 5 input, analog input an4. p5.5 146 i 0 1030 port 5 input, analog input an5. table 2 pad definitions and functions (continued) symbol pad num in / out position [m] function xy
c167cr bare die step ga data sheet 12 1999-11 note: all v ss pads and all v dd pads must be connected to the system ground and the power supply, respectively. the pad definitions and locations in this table are only valid for the indicated device and design step. handling of unconnected pads signal input stages may generate undesired switching noise and cross-current when left open. respect the following precautions for unconnected (not bonded) pads: p5.6 147 i 0 868 port 5 input, analog input an6. p5.7 148 i 0 705 port 5 input, analog input an7. p5.8 149 i 0 543 port 5 input, analog input an8. p5.9 150 i 0 380 port 5 input, analog input an9. table 3 precautions for unconnected pads pad type recommended action related pads power supply always connect! v dd , v ss , v aref , v agnd standard io pads switch to output port0, port1, p2, p3, p4, p6, p7, p8 input port pads disable input stages via p5didis p5 double-bond ports connect port pad (45, 48), if the alternate output (46, 49) is used. 1) 1) port pad is input in this case! if the port pad is used, the corresponding alternate output pad may be left open. p3.12 (45/46), p3.15 (48/49) configuration lines always connect! ea , rom128k, xp1_en required control lines always connect! xtal1, rstin , nmi optional control lines can be left open owe, rd , wr (l ), ready , ale, rstout table 2 pad definitions and functions (continued) symbol pad num in / out position [m] function xy
c167cr bare die step ga data sheet 13 1999-11 functional description as the standard packaged devices are made from this silicon the c167cr-xc dies provide exactly the same functionality and behaviour. also the dc characteristics and ac characteristics are compatible with those of the packaged devices. for a description of the functionality and the dc and ac parameters please refer to the following documents (or later versions thereof): c167cr data sheet 1999-10 c167 derivatives user ? s manual version 2.1 figure 3 block diagram
c167cr bare die step ga data sheet 14 1999-11 absolute maximum ratings note: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. during absolute maximum rating overload conditions ( v in > v dd or v in < v ss ) the voltage on v dd pins with respect to ground ( v ss ) must not exceed the values defined by the absolute maximum ratings. table 4 absolute maximum rating parameters parameter symbol limit values unit notes min. max. storage temperature t st -65 150 c junction temperature t j -40 150 c under bias voltage on v dd pins with respect to ground ( v ss ) v dd -0.5 6.5 v voltage on any pin with respect to ground ( v ss ) v in -0.5 v dd +0.5 v input current on any pin during overload condition -10 10 ma absolute sum of all input currents during overload condition - |100| ma
c167cr bare die step ga data sheet 15 1999-11 operating conditions the following operating conditions must not be exceeded in order to ensure correct operation of the c167cr-xc. the operating conditions for the c167cr-xc are identical with the conditions for the packaged parts. please refer to the mentioned data sheets. note: temperature specifications refer to the carrier side of the die ( t d ). storage conditions the c167cr-xc dies may be stored for a certain time under the conditions described below. table 5 bare die storage conditions and duration packing environment temperature rel. humidity storage time vacuum pack air 15...30 c < 60 % < 4 months
c167cr bare die step ga data sheet 16 1999-11 chip outline figure 4 0.38 6.320 6.144 dimensions in mm 0.090 0.090 0.125 x y 0,0 min typical
c167cr bare die step ga data sheet 17 1999-11 the wafers are glued to a plastic tape which is fixed within a plastic ring (see figure below). wafers can be shipped in one piece or sawn into individual dies. note: please refer also to the document " bare die packing information ". table 6 wafer characteristics item characteristic chips per wafer 373 (geometrically) metallization layers 2 metallization material alcu metallization thickness met1: 400 nm, met2: 800 nm metallization barrier material ti metallization isolation sog-cmp metallization material on pads alsicu (al 98.5% - si 1% - cu 0.5%) passivation oxide (310 nm) + nitride (510 nm), polyimid backside metallization none (silicon) inkdot diameter 1.0-1.3 typical
c167cr bare die step ga data sheet 18 1999-11 wafer outline figure 5 152.4 (6 ? ) dimensions in mm 210 230 plastic frame plastic tape wafer
c167cr bare die step ga data sheet 19 1999-11
c167cr bare die step ga data sheet 20 1999-11 published by infineon technologies ag

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